EZ500-p LED Chips

Cree’s EZBright® LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. Additionally, these LEDs are die-attachable with conductive adhesive, solder paste or solder preforms, as well as flux eutectic attach. These vertically structured, low forward voltage LED chips are approximately 170 microns in height and are tested for conformity to optical and electrical specifications. Cree’s EZ™ chips are useful in a wide range of applications including general illumination, automotive lighting and wearable devices.

FEATURES:

  • Lambertian Radiation Pattern
  • Anode-up design (p-pad up)
  • EZBright LED Technology, binned @ 175 mA   
    • 450 nm – 220+ mW
    • 460 nm – 200+ mW
    • 470 nm – 180+ mW
    • 527 nm – 60+ mW
  • Low Forward Voltage (Vf) – 3.2 V Typical at 175 mA
  • Maximum DC Forward Current – 300 mA
  • Backside Metal versions for various attach methods:
    • -A (AuSn) for use with Conductive Adhesives, Flux Eutectic Attach, Solder Paste & Solder Preforms
    • -G (LTDA) for Low Temperature Flux Eutectic Attach
  • 2kV Class 2 ESD Rating

Related Documents

Data Sheets Version Last Updated
- 01 Dec 2016
Sales Terms Version Last Updated